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A Chiplet based SmartNIC Platform using Bunch-of-Wires (Open Compute Project) View |
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ODSA's Bunch of Wires (BoW) PHY for Die Disaggregation Applications (Open Compute Project) View |
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Chiplet Innovation Ecosystem (Open Compute Project) View |
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ODSA's Lightweight BoW Link Layer for Die Disaggregation Applications (Open Compute Project) View |
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Apple's Secret Chiplet Weapon - The Future Of Computer Chips (Tomorrow's Investing) View |
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OCP 2020 Tech Week: Lightning Talk: Chiplet Design Xchange Update (Open Compute Project) View |
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Chiplets for addressing Challenges and Use cases for AI and ML applications (Open Compute Project) View |
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AMD's Chiplet Revolution - Unveiling The Future Of Computing (Tomorrow's Investing) View |
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OSDI '23 - Characterizing Off-path SmartNIC for Accelerating Distributed Systems (USENIX) View |
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DAC 2023, Day 2: Digital Twins, Chiplets and Curvy Design (EE Times) View |